Applicatio:Aerospace, BMS, Communicatio, Computer, Consumer Electronics, Domus appliance, ductus, Instrumenta medica, Motherboard, electronics smart, Wireless increpans
Pluma: Fexible PCB, Alta densitas PCB
Insulation Materials: Epoxy Resina, Metales compositorum, Resinae Organicae
Stratis: 1-22 layers
tabulae crassitudinis: 1.6 mm
Crassitudo aeris: I OZ
Basis materia: FR4
Minimum magnitudine foraminis: 0.2mm
Minimum line width: 4 mil
Finis superficies: ne gratis HASL
HT-S1105DS mini pactus est soho 5 port 10/100mbps 4pin capitis retis switch PCBA. Portus capitis constructus 5 10/100mbps 4pin habet. Obturaculum n fabula, configuratione opus non est. Initus intentione 3.3V.
Potestas, nexus/actus ductus indicibus solutionem fusa molestiam festinanter praebent.
Exemplar Number: TC280
Categoria: Superficies Mount PCB Terminal Cuneos
Ambitus: 2Pin
Current Rating: 3.0A
Voltage Rating: 200V
PC Board adscendens Directio: Latus viscus
Flamma Retardant Properties: V1
Nulla Materias: Resinae Synthetica
Materia: Fibreglass Sheet
Mechanica Rigid: Fexible
Processus Technology: Pressura mora Foil, Electrolytic Foil
Applicatio: Communicatio, Computer, Consumer Electronics, Domus appliance, Instrumenta Medica, Motherboard, electronics dolor, Wireless increpans
Pluma: Fexible PCB, Alta densitas PCB
Insulation Materials: Epoxy Resin, Metal Composita Materia
Materia: Fibreglass epoxy resinae & Polyimide Resinae
Processus Technology: Pressura mora Foil, Electrolytic Foil
Applicatio:Aerospace, BMS, Communicatio, Computer, Consumer Electronics, Domus appliance, ductus, Instrumenta medica, Motherboard, electronics smart, Wireless increpans
Pluma: Fexible PCB, Alta densitas PCB
Insulation Materials: Epoxy Resina, Metales compositorum, Resinae Organicae
Materia: Aluminium opertum Cuprum ffoyle Stratum, Complex, Fibreglass epoxy, Fibreglass epoxy resinae & Polyimide Resinae, Paper Phenolic Copper Foil Substratum, Synthetica Fibra
Processus Technology: Pressura mora Foil, Electrolytic Foil
Facimus pcb et pcb conventus unus-statur officium officinarum. 400people est summa. 20% auget volumen venditionum quolibet anno. 70% productio omnia ex partibus transmarinis. facimus 1-12layer.FR4.CEM-1.CEM-3.HDI. AL materiam.
Aerospace, Communicatio, Computer, Consumer Electronics, Domus appliance, DUCTUS, Instrumenta Medica, Motherboard, electronics Smart electronics, Wireless increpans
Flamma Retardant Properties: V0, V1, V2
Insulation Materials: Epoxy Resina, Metales compositorum, Resinae Organicae
Materia: Complex, Fibreglass Epoxy, Charta Phenolic Copper Foil Substratum, Fiber Syntheticum, Charta Orbis Gas Resinae
Mechanica Rigid: Fexible
Pluma: Rigidum flex pcb
Stratis: Multilayer
Applicatio:
Aerospace, BMS, Communicatio, Computer, Consumer Electronics, Domus appliance, DUCTUS, Instrumenta Medica, Motherboard, electronics Smart electronica, Wireless increpans
Nulla materias:
Epoxy Resin, Materiae Metallicae compositae, Resinae Organicae
Materia:
Aluminium Tectae Cuprum Foil Stratum, Complex, Fibreglass Epoxy, Fibreglass epoxy Resinae & Polyimide Resinae, Paper Phenolic Aeris Foil Substrate, Synthetica Fibra
Processus Technologiae:
Pressura mora Foil, Electrolytic Foil