Applicatio: Aerospace, BMS, Communicatio, Computer, Consumer Electronics, Domus appliance, DUCTUS, Instrumenta Medica, Motherboard, electronics smart, Wireless increpans
Pluma: Fexible PCB, Alta densitas PCB
Insulation Materials: Epoxy Resina, Metales compositorum, Resinae Organicae
Materia: aluminium texit Cuprum ffoyle Stratum, Complexum, Fibreglass epoxy, Fibreglass epoxy resinae & Polyimide Resinae
Processus Technology: Pressura mora Foil, Electrolytic Foil