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OEM PCBA Clone Conventus Service Other PCB & PCBA Custom Electronics PCB Circuit Board

Description:

Applicatio: Aerospace, BMS, Communicatio, Computer, Consumer Electronics, Domus appliance, DUCTUS, Instrumenta Medica, Motherboard, electronics smart, Wireless increpans

Pluma: Fexible PCB, Alta densitas PCB

Insulation Materials: Epoxy Resina, Metales compositorum, Resinae Organicae

Materia: aluminium texit Cuprum ffoyle Stratum, Complexum, Fibreglass epoxy, Fibreglass epoxy resinae & Polyimide Resinae

Processus Technology: Pressura mora Foil, Electrolytic Foil


Product Detail

Product Tags

Specification

PCB Technical Capacity

Stratis massa productio: 2~58 stratis / Gubernator currit: 64 stratis

Maximilianus.Crassitudo Missae productio: 394mil (10mm) / Gubernator currit: 17.5mm

Materiae FR-4 (Latin FR4, Mid-Tg FR4, Hi-Tg FR4, Materia collecta libera) Halogen-Free, Ceramica repleta, Teflon, Polyimide, BT, PPO, PPE, Hybrida, Hybrida partialis, etc.

Min.Latitudo/Spatium interioris tabulatum: 3mil/3mil (HOZ), tegumen externum: 4mil/4mil(1OZ)

Maximilianus.Aeris Crassitudo 6.0 OZ / Gubernator currere: 12OZ

Min.Foraminis Size mechanica exercitio: 8mil(0.2mm) Laser exercitio: 3mil(0.075mm)

Superficies Finish HASL, immersio Aurum, immersio plumbi, OSP, ENIG + OSP, immersio , ENEPIG, auri digitus

Specialis Processus Sepultus Foramen, Foramen Caecum, Resistentia Embedded, Capacitas Embedda, Hybrida, Partialis Hybrida, Partialis densitas, Retro exercitatio, Resistentia temperantia.

PCBA technica capacitas

commoda ---- Professio Superficie-conscendens ac per foraminis solidatorium technologiae

---- Variae magnitudinis sicut 1206,0805,0603 components SMT technology

----ICT (In Circuit Test), FCT (Functional Circuit Test)

----PCB Conventus Cum UL,CE,FCC,Rohs Approbatio

---- Nitrogen gasi refluxus technologiae solidandae pro SMT.

---- High Standard SMT & Solder Conventus Line

---- Magna densitas tabulae collocationis technologiae facultatis inter se connexae.

Components passiva usque ad CCI magnitudinem, BGA et VFBGA, Leadless Chip Portitores / CSP

Duplex SMT Conventus, Pix tenuis ad 0.8mils, BGA Restituo et Reball

Testis Volans Probae Test, X-ray recognitionis AOI Test

SMT Position accurate 20 um
Components size 0.4×0.2mm(0105) —130×79mm, Flip-SCIPIO, QFP, BGA, POP
Maximilianus.pars altitudinis 25mm
Maximilianus.PCB magnitudine 680× 500mm
Min.PCB magnitudine non limitata
PCB crassitudine 0.3 ad 6mm
Undo-Solder Max.PCB latitudine 450mm
Min.PCB latitudine non limitata
Altitudo component Top 120mm/Bot 15mm
Sudorem Metal genus pars, totus, inlay, declinatio
Materia metallica Aeris, aluminium
Superficiem Conclusio plating Au,
Aeris vesicae rate Minus quam XX%
Press-apta Press range 0-50KN
Maximilianus.PCB magnitudine 800X600mm






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