Pluma: Support mos
Layer: Geminus-Laer, Multilayer, Single-Layer
Metallum Coating: Argentum, plumbum
Modus productionis: SMT
Type:BMS PCBA, Communicatio PCBA, Consumer electronicarum PCBA, Domus instrumentum PCBA, LED PCBA, Motherboard PCBA, Smart electronics PCBA, Wireless increpans PCBA
Applicatio: Electronic fabrica, Oem electronica
Supplier Type: Factory, Manufacturer, Oem/odm
Superficiem Consummatione: Hasl, Hasl ducere liberum
Exemplar Number: SHE75192A-10H(A1)
Origin: Guangdong, China
Nomen notam: Sanhua
Crassitudo aeris: 5 oz
Key Specifications / Features speciales:
Princeps densitatis concatenata tabula collocatione technologiae facultatem
Key Specifications / Features speciales:
PCB massae productionis fabricandi sumus in Shenzhen provincia Sinarum, cum UL et TS 16949 approbata, locus noster prope Shanghai cum vectura opportuno proximus est.
Nostra producta, quae late in tectis ducitur et velit accensis, currus accensis et retro agris illustrandis et magis adhibitis,
Omnes MC PCBs consuetudine facta sunt, mitte Gerber limam et requisita pro quote.
Key Specifications / Features speciales:
XinDaChang propria est in sequentibus locis:
PCBA clone et PCB conventus PCB layout et fabricatio.
Lead- Free HASL / Plating gold / immersio gold / Ni / Au Plating gold finger.
tium procurationem.
Solutiones integrae provisoris.
Unius quadrangulus, duplex postesque, multilayer.
Flexibile, ex requisitis emptoris dependet.
Viridis / Nigrum / Rubrum / Flavo / Alba / Blue ...
Offertorium products cum auctoris pretio.
Breve tempus ducere.
Applicatio:
Aerospace, BMS, Communicatio, Computer, Consumer Electronics, Domus appliance, DUXERIT, Instrumenta Medica, Motherboard, electronics Smart electronics, Wireless increpans.
Pluma:Fexibilis PCB, Alta densitas PCB.
Nulla materias:Epoxy Resin, Materiae Metallicae compositae, Resinae Organicae.
Materia:Aluminium opertum Cuprum Foil Stratum, Complexum, Fibreglass epoxy, Fibreglass epoxy Resinae & Polyimide Resinae, Paper Phenolic Aeris Foil Substratum, Synthetica Fibra.
Processus Technologiae: Mora Pressura Foil, Electrolytici Foil.
Key Specifications / Features speciales:
Our Service
• One-stop turnkey OEM/ODM PCBA officia.
• pcb, pcb design, PCBA, PCB conventus: SMT, PTH et BGA, Contractus Vestibulum, ministerium Turnkey, Services ipsum.
• tium acquisitio mfm.
• Programma ardens.
• Test: AOI, X-Ray, in circuitu test (ICT), test muneris (FCT).
• Celeri prototyping, NPI, DFM/DFT, figtura creationis, designatio packaging.
• Filum phaleras, cables conventus, scheda metallica conventus, Plastics et Molds.
• Product final ecclesia.
Specificationes principalis / Features:
Utilitas nostra
• Dives usus in electronicis operandis pro PCB PCBA.
• One - stop service | | PCB fabricandi componentes acquirunt et PCB conventus, adiuva te facillime consequi tua electronica producta.
• Cooperamur in industriis telecommunicationum involventium, rerum interreti, frequentiae radiophonicae, prudentiae moderatio, securitatis, medicinae, industriae;autocinetum, 3G/4G/5G producta.
• Rationabile ac firmum pretium: Fortis globalis copia torquem partium electronicarum conditum est, ut nos rationabiles et stabiles pretium obtineamus.
Key Specifications / Features speciales:
PCB comitia key specifications/special features:
Conventus noster PCB/OEM/ODM officia fabricandi contractus supra 10 annos:
PCB fabricandi et layout: 1 ad 20 stratis
Components global procurationis facultatem
Mechanica facultatem
PCB conventus (SMT + SUMMERGO + programmatio + probatio)
Key Specifications / Features speciales:
Quod XinDaChang offerre potest:
1. Typis Circuit Board conventus
2. Turnkey & Box aedifica ecclesiam
3. Mixta technologia PCB ecclesia
4. Cable et filum armis conventus
5. Low / Mid / High vol PCB assembly
6. BGA / QFN conventus cum X-radii inspectione
7. IC programmatio / Munus probatio / ICT inspectionis
8. Celeri responsio includit scntentiam et disputationem technicam et traditionem
Applicatio:
Aerospace, BMS, Communicatio, Computer, Consumer Electronics, Domus appliance, DUXERIT, Instrumenta Medica, Motherboard, electronics Smart electronics, Wireless increpans.
Pluma:Fexibilis PCB, Alta densitas PCB.
Nulla materias:Epoxy Resin, Materiae Metallicae compositae, Resinae Organicae.
Materia:Aluminium opertum Cuprum Foil Stratum, Complexum, Fibreglass epoxy, Fibreglass epoxy Resinae & Polyimide Resinae, Paper Phenolic Aeris Foil Substratum, Synthetica Fibra.
Processus Technologiae: Pressura mora Foil, Electrolytic Foil