OEM PCBA Clone Conventus Service Other PCB & PCBA Custom Electronics PCB Circuit Tabula Featured Image

OEM PCBA Clone Conventus Service Other PCB & PCBA Custom Electronics PCB Circuit Board

Brevis descriptio:

Applicatio:Aerospace, BMS, Communicatio, Computer, Consumer Electronics, Domus appliance, ductus, Instrumenta medica, Motherboard, electronics smart, Wireless increpans

Pluma: Fexible PCB, Alta densitas PCB

Insulation Materials: Epoxy Resina, Metales compositorum, Resinae Organicae

Materia: Aluminium opertum Cuprum ffoyle Stratum, Complex, Fibreglass epoxy, Fibreglass epoxy resinae & Polyimide Resinae, Paper Phenolic Copper Foil Substratum, Synthetica Fibra

Processus Technology: Pressura mora Foil, Electrolytic Foil

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Product Detail

Product Tags

Specification

PCB Technical Capacity

Stratis massa productio: 2~58 stratis / Gubernator currit: 64 stratis

Maximilianus. Crassitudo Missae productio: 394mil (10mm) / Gubernator currit: 17.5mm

Materiae FR-4 (Latin FR4, Mid-Tg FR4, Hi-Tg FR4, Materia collecta libera) Halogen-Liberum, Ceramicum refertum, Teflon, Polyimide, BT, PPO, PPE, Hybrida, Hybrida partialis, etc.

Min. Latitudo/Spatium interioris tabulatum: 3mil/3mil (HOZ), tegumen externum: 4mil/4mil(1OZ)

Maximilianus. Aeris Crassitudo 6.0 OZ / Gubernator currere: 12OZ

Min. Foraminis Size mechanica exercitio: 8mil(0.2mm) Laser exercitio: 3mil(0.075mm)

Superficies Finish HASL, immersio Aurum, immersio plumbi, OSP, ENIG + OSP, immersio , ENEPIG, auri digitus

Specialis Processus Sepultus Foraminis, Foramen Caecum, Resistentia Embedded, Capacitas Embedda, Hybrida, Partialis Hybrida, Partialis densitas, Retro exercitatio, Resistentia temperantia.

PCBA technica capacitas

commoda ---- Professio Superficie-conscendens ac per foraminis solidatorium technologiae

---- Variae magnitudinis sicut 1206,0805,0603 components SMT technology

----ICT (In Circuit Test), FCT (Functional Circuit Test)

----PCB Conventus Cum UL,CE,FCC,Rohs Approbatio

---- Nitrogen gasi refluxus technologiae solidandae pro SMT.

---- High Standard SMT & Solder Conventus Line

---- Magna densitas tabulae collocationis technologiae facultatis inter se connexae.

Components passiva usque ad CCI magnitudinem, BGA et VFBGA, Leadless Chip Portitores / CSP

Duplex SMT Conventus, Pix tenuis ad 0.8mils, BGA Restituo et Reball

Testis Volans Probe Test, X-ray recognitionis AOI Test

SMT Position accurate	20 um
Components size	0.4×0.2mm(0105) —130×79mm, Flip-SCIPIO, QFP, BGA, POP
Maximilianus. pars altitudinis	25mm
Maximilianus. PCB magnitudine	680× 500mm
Min. PCB magnitudine	non limitata
PCB crassitudine	0.3 ad 6mm
Undo-Solder Max. PCB latitudine	450mm
Min. PCB latitudine	non limitata
Altitudo component	Top 120mm/Bot 15mm
Sudorem Metal genus	pars, totus, inlay, declinatio
Materia metallica	Aeris, aluminium
Superficiem Conclusio	plating Au,
Aeris vesicae rate	Minus quam XX%
Press-apta Press range	0-50KN
Maximilianus. PCB magnitudine	800X600mm