Applicatio:Aerospace, BMS, Communicatio, Computer, Consumer Electronics, Domus appliance, ductus, Instrumenta medica, Motherboard, electronics smart, Wireless increpans
Pluma: Fexible PCB, Alta densitas PCB
Insulation Materials: Epoxy Resina, Metales compositorum, Resinae Organicae
Materia: Aluminium opertum Cuprum ffoyle Stratum, Complex, Fibreglass epoxy, Fibreglass epoxy resinae & Polyimide Resinae, Paper Phenolic Copper Foil Substratum, Synthetica Fibra
Processus Technology: Pressura mora Foil, Electrolytic Foil